AR6003 Datasheet PDF learn more.
Part number : AR6003
Functions : This is a kind of semiconductor. Single Chip 802.11n MAC/BB/Radio.
Pin arrangement :
Package information :
Manufacturer : Atheros
The texts in the PDF file :
Data Sheet January 2010 AR6003 Single Chip 802.11n MAC/BB/Radio for Embedded Applications General
The Atheros AR6003 is a single chip, small form factor IEEE 802.11 a/b/g/n MAC/baseband/ radio optimized for low-power mobile applications. It is the 3rd generation WLAN design in the ROCm® family, employing the world’s lowest power consumption WLAN architecture in the smallest possible form factor. The AR6003 is a single stream 1×1 802.11n implementation providing improved link robustness, extended range, increased throughput and better performance for an unparalleled user experience. The AR6003 is part of the AlignTM product family. The AR6003 family implements sophisticated design techniques to deliver a solution which will greatly extend the battery life of mobile and embedded systems. It leverages its near-zero power in idle and stand-by modes to enable users to leave WLAN “always-on” without impacting battery life. The AR6003 family implements Atheros’ proprietary Internal Efficient Power AmplifierTM (EPA) technology in CMOS with advanced linearization algorithms and an internal LNA, thereby reducing the BOM costs in the system design. It provides the option for an additional external PA for larger output power if needed. The AR6003 has additional LDOs to provide noise isolation for digital and analog supplies. The AR6003 family supports 2-, 3-, and 4-wire Bluetooth coexistence protocols with advanced algorithms for predicting channel usage by a colocated Bluetooth transceiver. The AR6003 family provides multiple peripheral interfaces including UART, SPI, I2C, etc., via 26 GPIO pins. The only external clock source needed for AR6003-based designs is a high-speed crystal or oscillator. A variety of reference clocks are supported which include 19.2, 24, 26, 38.4, 40 and 52 MHz. AR6003 chips are available in Wafer Level Chip Scale Packages (WLCSP) or Ball Grid Arrays (BGA) packaging. AR6003
■ All-CMOS IEEE 802.11a/b/g/n or 802.11b/ g/n singl [ … ]
AR6003 PDF File