74HC02AP – TC74HC02AP

74HC02AP Datasheet PDF learn more.

Part number : 74HC02AP

Functions : This is a kind of semiconductor. TC74HC02AP.

Pin arrangement :

Package information :

Manufacturer : Toshiba Semiconductor

Image :

74HC02AP Datasheet PDF

The texts in the PDF file :

TC74HC02AP/AF/AFN TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HC02AP,TC74HC02AF,TC74HC02AFN Quad 2-Input NOR Gate The TC74HC02A is a high speed CMOS 2-INPUT NOR GATE fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. The internal circuit is composed of 3 stages, including a buffer output, which provide high noise immunity and stable output. All inputs are equipped with protection circuits against static discharge or transient excess voltage. Note: xxxFN (JEDEC SOP) is not available in Japan. TC74HC02AP

Features

• • • • • • • • High speed: tpd = 6 ns (typ.) at VCC = 5 V Low power dissipation: ICC = 1 μA (max) at Ta = 25°C High noise immunity: VNIH = VNIL = 28% VCC (min) Output drive capability: 10 LSTTL loads Symmetrical output impedance: |IOH| = IOL = 4 mA (min) ∼ tpHL Balanced propagation delays: tpLH − Wide operating voltage range: VCC (opr) = 2~6 V Pin and function compatible with 74LS02 TC74HC02AF TC74HC02AFN Pin Assignment Weight DIP14-P-300-2.54 SOP14-P-300-1.27A SOL14-P-150-1.27 : 0.96 g (typ.) : 0.18 g (typ.) : 0.12 g (typ.) IEC Logic Symbol 1 2007-10-01 Datasheet pdf – http:/// TC74HC02AP/AF/AFN Truth Table A L L H H B L H L H Y H L L L Absolute Maximum Ratings (Note 1) Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating −0.5~7 −0.5~VCC + 0.5 −0.5~VCC + 0.5 ±20 ±20 ±25 ±50 500 (DIP) (Note 2)/180 (SOP) −65~150 Unit V V V mA mA mA mA mW °C Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temp [ … ]

74HC02AP PDF File



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